Wi-Corr Bond



Version

1



Registered Product Information

Manufacturer: 3-Sci
Product Name: Wi-Corr Bond
Product Description: Ultrasonic Metal Thickness Measuring Device
Protocol: HART
Profile: HART Field Device
Date: 9/28/2021
More Information: Wi-Corr® Bond uses ultrasonic sensors adhered directly by the user onto metal surfaces. Measurements of the wall thickness at each specific location are sent back to a central controller over the Radio Frequency (RF) mesh network. Automatically-processed data revealing wall thickness can be viewed. Corrosion and erosion trends and safety margins can then be deduced. Alarms can be set to warn the user of excessive metal loss. All this capability allows better process control and proactive planning of maintenance by the asset manager. Wi-Corr® Bond provides Accurate, Easy to Install, Corrosion and Erosion Monitoring. Wi-Corr® Bond is a revolutionary wireless monitoring system suitable for use in explosive atmospheres. Through a self-organising network of permanently-installed, wireless-enabled sensors, accurate metal wall thickness and temperature can be obtained. Enabling corrosion and erosion to be precisely monitored. The system can be applied to many environments. For refineries and petrochemical plant, the information provided allows an analysis of the impact of feedstock selection or chemical process and a proactive approach in planning of turnarounds and preventative action. For any other applications where there are concerns over metal-wall thinning, Wi-Corr® provides ‘fit-and-forget’ and immediate reporting capability to allow continuous, long-term monitoring of those structures of concern.

Registered Product Details

Manufacturer ID (hex): 00611A
Device Type ID (hex): E457
DEV_REV (hex): 0x01
DD Revision: 0x01
Technology Version: 7
Wireless Product: Yes

Registration Information

Registration Authority: FieldComm Group
Registration Status: Registered

Contact Information